Semiconductor Digest

A new atom-thin carbon film developed at NUS CDE could help overcome one of the biggest barriers to faster and more energy-efficient microchips. The post NUS CDE Researchers Develop Atom-Thin Carbon Insulator for Next-Generation Microchips appeared first on Semiconductor Digest .

In this Q&A, Brad Hopper, VP of Vertical Markets at Spotfire, explains how fabs, foundries, and equipment makers are turning to analytics and AI to squeeze more yield, quality, and throughput out of existing capacity rather than waiting for new capacity to come online. The post Magnifying the Engineer: Where AI Fits in Semiconductor Analytics appeared first on Semiconductor Digest .

KAIST and Samsung Electronics have developed a new, long-lasting catalyst based on ‘entropy stabilization,’ a principle in which mixing multiple metal atoms together actually stabilizes the catalyst’s structure. The post KAIST Tames a Semiconductor Greenhouse Gas 6,000 Times More Potent than CO₂ with the ‘Power of Disorder’ appeared first on Semiconductor Digest .

Researchers co-design engineered semiconductors and metasurfaces to build powerful optical device. The post New Device Design Could Miniaturize Photonics, Quantum Technologies appeared first on Semiconductor Digest .

The investment supports growing semiconductor demand and strengthens local supply by year-end. The post Solvay Expands Electronic Grade Hydrogen Peroxide Capacity in Taiwan appeared first on Semiconductor Digest .

Second quarter 2026 billings registered an 11% quarter-over-quarter growth. The post Global Semiconductor Equipment Billings Increased 23% Year-Over-Year in Q2 2026, SEMI Reports appeared first on Semiconductor Digest .

Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives. The post NanoBridge Semiconductor Adopts Siemens’ Precision FPGA Synthesis for Low-Power and Harsh-Environment S…

Semiconductor advanced packaging equipment manufacturer, Manz Asia, today announced a strategic collaboration with SUSS, a manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications. The post Manz Asia and SUSS Announce Strategic Collaboration in Semiconduct…

Glasgow expansion will increase InP manufacturing capacity to more than 100 million CW DFB lasers annually, supporting anticipated AI infrastructure customer ramps. The post Sivers Semiconductors Invests $30 Million to Expand European Photonics Manufacturing for AI Datacenters appeared first on Semiconductor Digest .

China-based panel makers are forecast to account for 65.2% of global automotive display shipments in the second half of 2026, up from 59.0% in the first half, according to new research from Omdia. The post Omdia: China-Based Panel Makers to Capture 65% of Automotive Display Shipments in 2H26 appeared first on Semiconductor Digest .

Gigaphoton Inc., a manufacturer of lightsources for leading-edge semiconductor fabrication processes, will present results demonstrating continued advances in its tin laser-produced plasma (Sn-LPP) extreme ultraviolet (EUV) lightsource technology for actinic photomask inspection. The post Gigaphoton to Present on EUV Lightsource Advances for Actinic Mask Inspection at SPIE Photomask Technology + …

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the September issue and pick up an issue in print at SEMICON West! The post What’s in the September Issue? appeared first on Semiconductor Digest .

Newest feature-rich CMOS platform family combines ultra-low power connectivity, sensing and mixed-signal innovation with cost-efficient manufacturing for next-generation edge devices. The post GlobalFoundries Announces Customer Availability of UX Platform Technologies appeared first on Semiconductor Digest .

Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM. The post GlobalFoundries and RAAAM Memory Technologies Announce the Joint Development appeared first on Semiconductor Digest .

A novel microwave-induction technique drives current into a semiconductor structure without touching it, opening a path to inline quality control based on electrical data in production fabs. The post QuantumDiamonds Reaches Key Milestone on the Path to Inline Electrical Inspection with Contact-Free Current Imaging appeared first on Semiconductor Digest .

The partnership was formalized through the signing of a Memorandum of Understanding (MOU) at SEMICON Taiwan 2026. The post SEMI and Silicon Catalyst Aim to Accelerate Global Semiconductor Innovation with Strategic Partnership appeared first on Semiconductor Digest .

New partnership will bring Everspin 256Mb PERSYST MRAM into Teledyne HiRel Semiconductors’ memory solutions for mission-critical systems. The post Everspin Technologies and Teledyne HiRel Semiconductors Partner to Accelerate MRAM Adoption in Aerospace and Defense Applications appeared first on Semiconductor Digest .

Drawing on decades of expertise in advanced packaging, heterogeneous integration and photonics manufacturing, EVG supports multiple stages of the CPO manufacturing value chain. The post EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics appeared first on Semiconductor Digest .

Kulicke and Soffa Industries, Inc. continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio. The post Kulicke & Soffa Advances AI Infrastructure Through Co-Packaged Optics (CPO) and Advanced Packaging Leadership appeared first on Semiconductor Digest .

Teradyne, Inc., a provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing. The post Teradyne Launches Advanced UltraFLEXplus Instruments Engineered for AI and Data Center Computing Devices appeared first on Semiconductor Di…