Semiconductor Digest

Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures. The post Xanadu, ASML to Advance Lithography for Photonic Quantum Hardware appeared first on Semiconductor Digest .

Synopsys and A*STAR IME collaborate on advanced packaging, chiplet architectures, and simulation technologies. The post Synopsys and A*STAR IME Join Forces to Accelerate Innovation for Advanced Semiconductor Packaging appeared first on Semiconductor Digest .

Industry, university, community college, and workforce leaders unite to guide the future of America's semiconductor workforce. The post National Network for Microelectronics Education Announces Inaugural Industry Advisory Committee to Help Shape America’s Semiconductor Workforce Strategy appeared first on Semiconductor Digest .

Physical AI is one of the hardest engineering problems the technology industry has faced. The post Synopsys Joins Arm Total Design for Physical AI to Advance Autonomous Systems appeared first on Semiconductor Digest .

Kyocera Corporation and the Research Institute of Electrical Communication (RIEC), Tohoku University have developed a new technology for integrating optical isolators onto silicon photonics chips using "laser annealing," a localized, laser-based heat-treatment method. The post Kyocera and Tohoku University Develop Technology to Integrate Optical Isolators Directly onto Silicon Photonics Chips app…

Positron AI, the AI inference hardware company built to make serving AI models dramatically cheaper and more energy efficient, today announced an $875 million Series C financing at a $5 billion post-money valuation. The post Positron AI Raises $875 Million at a $5 Billion Valuation to Bring Its Next-Generation Inference Silicon to Market appeared first on Semiconductor Digest .

Results of 15th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference. The post eBeam Initiative Survey of Semiconductor Luminaries Predicts a Bright Outlook for the Photomask Industry appeared first on Semiconductor Digest .

NY Creates today announced its inclusion in the 12-inch mask industry initiative, a newly formed collaboration designed to strengthen the high numerical aperture extreme ultraviolet (high NA EUV) lithography ecosystem. The post NY Creates Announces Participation in 12-Inch Mask Industry Initiative to Advance High NA EUV Lithography Ecosystem appeared first on Semiconductor Digest .

Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, where it will showcase next-generation semiconductor package substrate technologies. The post Samsung Electro-Mechanics Showcases Next-Generation Semiconductor Package Substrate Technologies …

Analog Devices, Inc. and Alif Semiconductor today announced that they have entered into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion. The post Analog Devices to Acquire Alif Semiconductor appeared first on Semiconductor Digest .

Taiyo Holdings Co., Ltd., based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series", a next-generation semiconductor-packaging material. The post Taiyo Holdings Launches Next-generation Semiconductor Packaging Material “FPIM Series” appeared first on Semiconductor…

Company partnering with GlobalFoundries to fabricate next-gen ion traps and control electronics, and Monarch Quantum to develop and manufacture reliable lasers and optical components. The post Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce appeared first on Semiconductor Digest .

SEMI outlines nine policy recommendations in its latest Position Paper on the Chips Act 2.0, aimed at helping ensure Europe remains a vital contributor to the global semiconductor ecosystem. The post SEMI Calls on the Chips Act 2.0 to Strengthen Semiconductor Competitiveness and Resilience appeared first on Semiconductor Digest .

ASML Holding N.V. today marked the start of construction of its second major industrial campus in the Brainport region, the Netherlands. The post ASML Begins Construction of New Eindhoven Campus appeared first on Semiconductor Digest .

Vidya Vijay of Nordson Test & Inspection looks at how reliance on manual inspection and operator judgment has become one of the more understated bottlenecks in modern fabs. The post Closing the Gap: How Intelligent Sensing Is Reshaping Wafer Process Control appeared first on Semiconductor Digest .

An open circuit is one of the hardest failures to find in an advanced package: no current flows, so there's no heat, no photon emission, and often no visible structural defect for X-ray CT or thermography to catch. The post Finding the Fault That Leaves No Trace: Non-Destructive Localization of Opens in Advanced Packaging appeared first on Semiconductor Digest .

SEMIFIVE, a global provider of custom AI semiconductor (ASIC) solutions, announced today that it has begun mass production of a data center AI inference accelerator for HyperAccel. The post SEMIFIVE Commences Mass Production of HyperAccel’s LLM AI Inference Accelerator ‘Bertha’ on Samsung 4nm appeared first on Semiconductor Digest .

Award accelerates build-out of GF's Quantum Technology Solutions business and strengthens America's quantum semiconductor ecosystem. The post GlobalFoundries and U.S. Department of Commerce Finalize $375M R&D Award appeared first on Semiconductor Digest .

Taiwan Semiconductor Manufacturing Company and ASML Holding N.V. announced a collaborative initiative to lead the semiconductor industry’s transition to a larger-format Extreme Ultraviolet (EUV) lithography photomask. The post ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV appeared first on Semiconductor Digest .

A new atom-thin carbon film developed at NUS CDE could help overcome one of the biggest barriers to faster and more energy-efficient microchips. The post NUS CDE Researchers Develop Atom-Thin Carbon Insulator for Next-Generation Microchips appeared first on Semiconductor Digest .