Semiconductor Digest

Breakthrough addresses a key power supply challenge in wearable devices. The post SNU Researchers Develop Battery-Free Skin-Conformal Wearable System appeared first on Semiconductor Digest .

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited to acquire its NEXX business, a supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The post Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX appeared first on Semiconductor Digest .

Siemens today announced it has reached $1 billion in domestic manufacturing investments to support American industry, infrastructure and transportation over the past five years. The post Siemens Achieves $1B in U.S. Manufacturing Investments appeared first on Semiconductor Digest .

GlobalFoundries today announced the introduction of its SCALE optical module solution for co-packaged optics (CPO). GF’s SCALE solution, or Silicon photonics Co-packaged Advanced Light Engine solution, is the industry’s first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform. The post GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Cent…

New cooperation supports makers, educators, and commercial teams requiring fast, low-quantity FPGA access. The post GOWIN Semiconductor Collaborates with JLCPCB appeared first on Semiconductor Digest .

Amtech Systems, Inc., a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, today announced the appointment of Mr. Thomas Sabol as the Company’s Chief Financial Officer, effective May 14, 2026. The post Amtech Systems Appoints Thomas Sabol as Chief Financial Officer appeared first on Semiconductor Digest .

Quiptech Mexico will serve as an authorized distributor for Nordson Test & Inspection products in Mexico, providing local sales, technical support, and responsive service. The post Nordson Test & Inspection Announces Partnership with Quiptech Mexico appeared first on Semiconductor Digest .

ULVAC, Inc. anticipates that orders for its continuous vacuum melting furnaces dedicated to rare-earth magnets will approximately triple year on year, driven primarily by magnet manufacturers in Europe and North America. The post ULVAC Establishes Japan-Based Production for Rare-Earth Magnet Vacuum Melting Furnaces appeared first on Semiconductor Digest .

Altera, the world’s largest pure-play FPGA solutions provider, today announced the release of FPGA AI Suite 26.1.1, a major update to its AI software platform. The post Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite appeared first on Semiconductor Digest .

PsiQuantum today announced that Lip-Bu Tan, a leader of the semiconductor industry and Chief Executive Officer of Intel Corporation, has joined the PsiQuantum Board of Directors. The post PsiQuantum Appoints Lip-Bu Tan to Board of Directors appeared first on Semiconductor Digest .

The IEEE/JSAP Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits in the microelectronics industry for the last 45 years, creating maximum synergy between both domains. The post The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Will Feature Advances in Microelectronics appeared first on Semiconductor Digest .

Everspin expands on-shore Toggle MRAM technology capabilities, adding support for U.S. government initiatives. The post Everspin Executes $40M Agreement for Mil-Aero MRAM Applications appeared first on Semiconductor Digest .

SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community. The post SEMI Appoints Julie Rogers Executive Director of the ESD Alliance appeared first on Semiconductor Digest .

The group will examine how MIPI specifications can support the rapidly developing humanoid application space. The post MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids appeared first on Semiconductor Digest .

POLYN Technology, a leader in neuromorphic technology with application-specific Neuromorphic Analog Signal Processing (NASP) products, has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring. The post POLYN Technology Announces Tapeout of Automotive Chip appeared first on Semiconductor Digest .

This strategic move is designed to support the infrastructure behind AI and cloud growth, where accurate, reliable flow measurement is essential to mission-critical cooling and process operations. The post KROHNE Dedicates Production Capacity and Establishes U.S. Center of Excellence to Support Explosive Growth in AI-Driven Data Centers appeared first on Semiconductor Digest .

The Southwest Advanced Prototyping (SWAP) Hub, led by Arizona State University, has been awarded $36.3 million in Year 2 funding from the Department of War under the CHIPS and Science Act. The post ASU-led Southwest Advanced Prototyping Hub Awarded $36.3M for Second Year of Funding for Microelectronics Projects appeared first on Semiconductor Digest .

Arizona State University is expanding its artificial intelligence research capabilities following a multimillion-dollar technology donation from Intel. The post ASU Supercharges AI Research Capabilities with Technology Donation appeared first on Semiconductor Digest .

AI-driven demand and signs of broad-based recovery boost global silicon wafer shipments, despite mixed market conditions. The post SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026 appeared first on Semiconductor Digest .

NEO Semiconductor, an innovator in advanced AI and memory technologies, today announced successful proof-of-concept (POC) results for its 3D X-DRAM technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems. The post NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory appeared…