semiconductors

Nature Communications, Published online: 25 May 2026; doi:10.1038/s41467-026-73144-7 The scarcity of effective doping strategies has so far limited the development of scalable complementary electronic circuits based on 2D semiconductors. Here, the authors report the fabrication of wafer-scale homogeneous top-gated complementary inverter arrays and logic circuits based on p-type and n-type doped 2…

Nature Physics, Published online: 25 May 2026; doi:10.1038/s41567-026-03293-5 Tuning of the Stark effect in black phosphorus is used to build adjustable digital and analogue circuits including a high-performance transistor array for neural networks. It offers a promising opportunity for next-generation electronics.

Core Advantages of MRAM in Aerospace: Radiation Hardening, Unlimited Read/Write, and Low Power Consumption With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace …

The eco-friendly gas C4F7N has emerged as a promising alternative to SF6 for online monitoring in gas-insulated switchgear (GIS) high-voltage (HV) electrical systems, but partial discharges-an inherent issue in such environments-cause C4F7N decomposition, generating byproducts like CF3CN. This study employs first-principles calculations to systematically investigate the adsorption and electronic …

American Journal of Engineering and Applied Sciences, Published online: 22 May 2026; doi:10.3844/ajeassp.2026.73.87 Cesium tin chloride (CsSnCl3) has drawn considerable interest as a non-toxic absorber candidate for next-generation photovoltaic devices, offering an attractive combination of affordability, thermal r...

Micron Technology, Inc. today is celebrating the start of 1α (1-alpha) DRAM manufacturing at its Manassas, Virginia, fab, an important step in the company's efforts to significantly expand U.S. memory manufacturing. The post Micron Advances Made-in-America Memory With Manufacturing Expansion in Virginia appeared first on Semiconductor Digest .

A new chip-making technique exploits a material’s crystal structure to create nanoscale patterns at room temperature directly onto hard materials used in devices, including silica. The post Stressed Crystal Creates Nanoscale Patterns on Chip Materials at Room Temperature appeared first on Semiconductor Digest .

The most advanced lithography system, crucial for future advanced memory and computer chips, will play a key role in scaling up quantum technology. The post imec Presents Quantum Dot Qubit Device Using High NA EUV Lithography appeared first on Semiconductor Digest .

Researchers develop a promising organic semiconductor material for multifunctional electronic devices. The post Toward Power-Generating Displays: A Single Device That Harvests And Emits Light appeared first on Semiconductor Digest .

Analog Devices, Inc. and Empower Semiconductor today announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion. The post Analog Devices to Acquire Empower Semiconductor appeared first on Semiconductor Digest .

Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. The post Asahi Kasei Develops Novel Photosensitive Polyimide Film for Advanced Panel-Level Semiconductor Packaging appeared first on Semiconductor Digest .

I've been looking into using the PEXSI solver for large moire supercell and defect supercell systems involving TMDs. However, SIESTA does not currently support SOC with the PEXSI solver. I did see in ...

Capturing important details without making calculations impractically expensive. The post Beyond Ideal Crystals: The Case For Scale In Atomistic Modeling appeared first on Semiconductor Engineering .

Reduce shallow trench isolation and recess nonuniformity introduced by pattern-dependent etch. The post Process Variation In The Era Of Scaling: Improving Uniformity With Dummy Fill appeared first on Semiconductor Engineering .

Warpage, heat, and brittleness can cause huge reliability problems for expensive designs. The post Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics appeared first on Semiconductor Engineering .

Researchers at the Department of Energy's Oak Ridge National Laboratory incorporated gallium nitride semiconductors to create a high-efficiency power converter that is more compact, affordable and efficient.