Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, where it will showcase next-generation semiconductor package substrate technologies. The post Samsung Electro-Mechanics Showcases Next-Generation Semiconductor Package Substrate Technologies for AI and Servers at ‘KPCA Show 2026’ appeared first on Semiconductor Digest .