semiconductor-industry

Researchers from Université Grenoble Alpes, CNRS, Grenoble INP have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”. Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…

Researchers from AMD released “CompPow: A Case for Component-level GPU Power Management”. Abstract “The ever increasing demand for ML-driven intelligence in a wide spectrum of domains has led to ubiquity of GPUs. At the same time, GPUs are notorious for their power consumption needs and often dominate power allocation in a typical ML datacenter. While... » read more The post Improving GPU Energy …

Epoch AI published a component-cost breakdown of a frontier AI accelerator this week, and the headline number is one that reframes a lot of the 2026 GPU conversation: memory now accounts for roughly two-thirds of the bill of materials. The logic die — the thing most people picture when they hear "AI chip" — is no longer the dominant cost. The stacks of high-bandwidth memory glued to it are. That …

Source files: GitHub For more than a year I have been chasing the same brick wall on the Remix Mini PC project: I could sideload a working Linux from an SD card, but the internal eMMC was a black box. Every attempt to read from it returned an I/O error. Every theory I tried — write-protect bits, NAND blacklists, hardware reset quirks, lockout states left behind by Android — went nowhere. It turns…

To meet the growing demand for AI infrastructure, AMD today announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The post AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure appeared first on Semiconductor Digest .

World Micro, a global distributor of electronic components and supply chain solutions, is pleased to announce a new distribution agreement with Mobilint, a pioneering developer of AI accelerator chips. The post World Micro Signs Distribution Agreement with Mobilint to Expand AI Semiconductor Solutions appeared first on Semiconductor Digest .

Taiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment chip design; quantum-dot qubit device fabricated w/high-NA EUV; EU flagship power electronics project; CNTs. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .

Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys are partnering with the UCLA Samueli School of Engineering to establish a $125 million Semiconductor Hub aimed at accelerating research and workforce development in artificial intelligence–powered chip technologies

Small-sized automotive AMOLED display shipments (under 5 inches) are expected to reach 1.5 million units by 2030, growing 541% versus 2025, according to new research from Omdia. The post Omdia: Small-Sized Automotive AMOLED Shipments to Reach 1.5 Million Units by 2030, Growing 541% appeared first on Semiconductor Digest .

A new technical paper, “SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving,” was published by researchers at Nvidia, with work done while at Groq. Abstract “The proliferation of large language models (LLMs) demands inference systems with both low latency and high efficiency at scale. GPU-based serving relies on HBM for model weights and KV... » read more The post Large-scale, SRAM-bas…

The new data storage technology is up to 30 times more radiation-resilient than current data storage.

The race to build faster wireless networks has just taken a major step forward. Researchers at Tokushima University have successfully demonstrated an ultra-fast wireless connection operating at 560 gigahertz (GHz), reaching speeds of 112 gigabits per second (Gbps). The breakthrough could help pave the way for future 6G communication systems that may one day support […] The post Scientists use mic…

Telecoms company CEO says tech firms are buying up memory chips to power datacentres relied on by AI Business live – latest updates BT has said that the cost of smartphones could rise as technology companies buy up semiconductor chips due to the boom in artificial intelligence (AI), putting pressure on supply chains. The telecoms company’s chief executive, Allison Kirkby, said she was anticipatin…

Inspection limits, curvilinear adoption, data volumes, and high-NA EUV are converging to stress the mask ecosystem The post Mask Technology Faces A New Set Of Challenges appeared first on Semiconductor Engineering .

PFlow Industries, the pioneer in vertical reciprocating conveyor (VRC) technology, highlights its VRCs, including the M Series and F Series, for the semiconductor industry. The post PFlow Industries Highlights VRCs for Semiconductor Manufacturing Environments appeared first on Semiconductor Digest .

The lack of growth-stage capital and slow commercialisation remain key issues for European start-ups in semiconductors, quantum and other deep tech sectors. The post Chips Act II: European Start-ups Need Faster Funding and Less Red Tape, Investor Says appeared first on Semiconductor Digest .

Supporting the creation and scaling of semiconductor deeptech ventures worldwide. The post Imec Expands the Global Footprint of imec.ventures with a Dedicated US Presence appeared first on Semiconductor Digest .

TSMC said its Board of Directors has approved capital appropriations of approximately US$31.28 billion to fund advanced technology capacity, fab construction, and fab facility systems, in one of the largest single-meeting capital authorizations in the foundry's history. The post TSMC Board Approves US$31.3 Billion Capital Appropriation appeared first on Semiconductor Digest .

Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and ASML, one of the world’s leading semiconductor equipment manufacturing companies, today, announced the signing of a Memorandum of Understanding (MoU) to advance the semiconductor manufacturing ecosystem in India. The post Tata Electronics and ASML Announce Strategic Partnership appeared first …