Chip Industry Technical Paper Roundup: May 5
Linda Christensen
3D-stacked near-memory LLM decoding; In-SoIC ESD protection for chiplets; thermal management for adv. packaging; quantum circuits on chiplets; agentic AI for formal verification; multilayer nanostructure characterization; liquid cooling for adv. packages; NV photonic coupler arrays. The post Chip Industry Technical Paper Roundup: May 5 appeared first on Semiconductor Engineering .