Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech et al.)
Technical Paper Link
A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging,” was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract “The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materials (TIMs), particularly... » read more The post Alumina Nanowires Improve Thermal Management in Advanced Pack