Energy-Efficient Liquid Cooling for Advanced Semiconductor Packaging (KAIST)
Technical Paper Link
A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000,” was published by researchers at KAIST. The study presents a CMOS-compatible manifold microchannel cooler that removes over 2,000 W/cm² using single-phase water at only 8 kPa pressure drop, achieving a record COP of 106,000—a significant improvement over... » read more The post Energy-Efficient Liquid Cooling for Advanced Semiconductor Packaging (KAIST) ap