Wafer-scale integration of single-crystalline molybdenum disulfide for flexible electronics using oxide dry transfer

Nature Electronics, Published online: 24 April 2026; doi:10.1038/s41928-026-01598-0 A wafer-scale, solvent- and polymer-free transfer method that uses a high-κ dielectric oxide as the transfer medium can create molybdenum disulfide transistors on flexible substrates with high mobilities, high on/off ratios and near-ideal subthreshold slopes.