Demystifying Dielectric Data – Correlating Dielectric Data with Thermoset Curing: Part Three

In the previous posts, the basics of dielectric analysis was presented. Part Three of this series will demonstrate the relationships between dielectric data during isothermal curing. First, let’s examine the isothermal during process. A nice example is the work of Bidstrup, Sheppard and Senturia at MIT in 1989 [1]. They examined the isothermal curing of DGEBA and DDS: - DGEBA (diglycidyl ether of bisphenol-A, a common difunctional epoxy) - DDS (diamino diphenyl sulphone, a common amine hardener.