IntroductionIn view of the high cutting temperature, severe tool wear and poor processing surface integrity caused by poor thermal conductivity of the material during the cutting process of workpieces, active thermal conductive medium microelectronic inkjet coating technology is proposed.MethodsThis technology applies a uniform thermally conductive medium layer on the surface of a pretreated workpieces through a scraping process. Three surface active media are used: copper powder thermally conductive glue, thermally conductive silicone grease and liquid graphene. A cutting temperature prediction model that considers both mechanochemical effects and enhanced heat transfer effects is built.ResultsExperimental results showed that the medium-enhanced heat transfer effect increased as its thermal conductivity increased, but the improvement tended to be flat after exceeding 80W/(m· °C). Compared with the state without media, coating with high thermal conductivity graphene media significantly reduced the tangential cutting force by 11.51%, lowered the chip thickness by 31.48%, and reduced the chip temperature and workpiece surface temperature by 12.13% and 27.37%. The residual tensile stress decreased by 25.18%, the surface roughness decreased from 0.54 μm to 0.41 μm, the surface microhardness decreased by 7.64%, and the depth of the hardened layer decreased by 32.16%.DiscussionThis technology exerts an efficient heat dissipation function of the medium, which can significantly inhibit the accumulated cutting heat, improve plastic deformation and optimize surface integrity, providing a feasible process solution for efficient and precise machining of key aerospace components.