LSTM-Based Automated Analysis of Laser-Groove Profiles in Wafer Dicing Using White-Light Interferometry Data

Laser grooving is a critical preparatory step in wafer dicing for advanced semiconductor packaging, ensuring reduced mechanical stress and improved dicing precision. However, groove quality assessment remains challenging due to profile irregularities and noise in depth measurement data. This paper presents an automated groove inspection system that leverages long short-term memory (LSTM) networks to analyze depth profiling data acquired via white light interferometry. The proposed method predict