IIEEE Transactions on Semiconductor Manufacturing1/1/2026Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDsZhihua Wang·Jiayu Sun·Qun Yan·Kaixin Zhang·Xiongtu Zhou·Chang LinRead at IEEE Transactions on Semiconductor ManufacturingTagsGaN-based semiconductor devices and materialsCondensed Matter Physics
