It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI applications. Pure indium, specifically, boasts a high bulk thermal conductivity (k = 86W/mK) on its own. The post The Role of Intermetallic Formation and Common Metallization Stack-Ups for Solder TIMs appeared first on indiumcorporation .