The ever-growing demand for more performant heat transfer devices has led to increasingly compact and complex designs. Additive manufacturing, and in particular Laser Powder Bed Fusion (LPBF), has been proposed as a viable route to produce such next-generation thermal components. While LPBF offers excellent resolution for most engineering materials, copper remains challenging due to its high thermal conductivity and low absorptivity at near-infrared (NIR) wavelengths, which hinder process stabil