Tailoring and Assessing Copper Nanoparticle Seeded Electroless Copper Plating on Polymer Microspheres

Electroless copper plating is a vital technique for depositing uniform and conductive copper layers, particularly for fabricating copper-coated polymer microspheres used in anisotropic conductive adhesives. However, achieving high-quality coatings on polymer microspheres remains challenging due to their inherent catalytic inertness and the lack of reliable evaluation metrics. Herein, copper nanoparticles are utilized as catalytic seeds for electroless copper plating on styrene-divinylbenzene (PS