As semiconductor manufacturing advances toward the 3 nm node and beyond, wafer sensitivity to particulate and moisture contamination becomes increasingly critical. During front opening unified pod (FOUP) door opening, airflow disturbances and deflection from the equipment front-end module (EFEM) can lead to the intrusion of external moisture and airborne molecular contaminants (AMC), potentially degrading wafer surface integrity and process yield. To address this, a high-velocity-type laminar ai