Maintaining a controlled environment is essential for preserving wafer quality and manufacturing yield, as humidity, oxygen, and airborne contaminants can degrade wafer surfaces during fabrication and storage. Computational fluid dynamics (CFD) simulations based on the k–ε turbulence model were applied to reduce relative humidity inside a front opening unified pod (FOUP) using clean dry air (CDA) purging. A guiding duct was designed to enhance CDA circulation between wafer layers, and the influe
