
thermal-management


The same overheating problem that happens to our laptops also plagues computer servers and data centers around the world—and heat management is only getting harder as computer chips get more compact and powerful. Understanding how heat moves through chips at the microscale is essential for continuing to improve their performance. Unfortunately, most methods for measuring […]
The post A new way to watch heat move through electronics appeared first on MIT Department of Materials Science and Engineering .

The same overheating problem that happens to our laptops also plagues computer servers and data centers around the world — and heat management is only getting harder as computer chips get more compact and powerful. Understanding how heat moves through chips at the micro scale is essential for continuing to improve their performance. Unfortunately, most […] The post A new way to watch heat move th…
Thermal constraints directly influence floorplanning, macro placement, and power delivery network topology. The post Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies appeared first on Semiconductor Engineering .
March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit. Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]


