thermal-management

Thermal constraints directly influence floorplanning, macro placement, and power delivery network topology. The post Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies appeared first on Semiconductor Engineering .

March 18, 2025 – Washington, D.C. – The Honorable Dr. Chris Wright, U.S. Secretary of Energy, made a visit to the Purdue University-led research team during the 2025 ARPA-E Energy Innovation Summit.  Dr. Wright experienced a live demonstration of the team’s innovative in-package direct-on-chip two-phase cooling technology, that is aimed at addressing the thermal challenges […]