MMaterials Science in Semiconductor Processing9d agoCFET channel stack fabrication by wafer-to-wafer bonding and BESOI donor dismountingP. Tchoulfian·B.T. Chan·F. Fournel·V. Loup·P. Hauchecorne·A.M. Papon·A. Thouvard·J. Richy·Y. Mazel·N. Gauthier·A. Fraczkiewicz·G. Pares·D. Schippers·U. Jain·S. Brems·R. Loo·J.M. Hartmann·D. Barge·V. Larrey·S. KerdilesRead at Materials Science in Semiconductor ProcessingTags3D IC and TSV technologiesElectrical and Electronic Engineering
