MMaterials Science in Semiconductor Processing5/11/2026Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature agingGuoli Sun·Shuye Zhang·Jinhong Liu·Jingyi Zhao·Jialin Zhang·Zhaoyu LiRead at Materials Science in Semiconductor ProcessingTagsCopper Interconnects and ReliabilityElectronic, Optical and Magnetic Materials
