Scalable and Sustainable Dry Microfabrication Enabled by High-Precision and Wafer-Scale Transfer Lithography of Commercial Photoresists

Abstract Conventional photolithography is inherently limited to flat, rigid, and stable substrates, which severely restricts its applicability to flexible, curved, and transient electronic devices. This work presents an innovative transfer method that exploits a phase-changing polymer with dynamically switchable adhesion to enable universal transfer of commercial photoresists onto a broad range of previously incompatible substrates, thereby overcoming the fundamental limitations of traditional p