MMaterials & Design3/22/2026

Ultrathin silver-indium transient liquid phase bonding enabled by a molybdenum diffusion barrier for void suppression

Donglin Zhang·Yongjun Huo·Miao Jiang·Xiuchen Zhao·Luke Ma·Gang Zhang·Yuan Zhang·Shuquan Chen·Wenqian Li

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Electronic Packaging and Soldering TechnologiesElectrical and Electronic Engineering