Analisis Kekuatan Struktur Rangka Alat Uji Konduktivitas Termal Berbasis Metode Elemen Hingga

Although thermal conductivity test apparatuses have been widely used to characterize the heat transfer properties of materials, studies that specifically address the strength of their supporting frame structures remain limited. In testing practice, the frame of the apparatus is subjected not only to thermal loads but also to mechanical loads arising from the weight of components and clamping forces, so an inadequate structure may experience excessive deformation, reduce measurement accuracy, and